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PVD Coatings Portfolio

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Physical Vapour Deposition (PVD) is a process to produce a metal vapour that can be deposited on electrically non-conductive and conductive materials as a thin highly adhered pure metal, ceramic or composite coating. Single or multi-layer coatings can be applied during the same process cycle. Additionally the metal vapour can be reacted with various gases (oxygen, nitrogen, acetylene…) to produce ceramic (Oxides, Nitrides, Carbides...) or composite films (Carbonitrides, Oxynitrides...).

The process is carried out in a vacuum chamber at high vacuum (2×10-2 Pa) using two types of PVD techniques: Cathodic arc evaporation and Magnetron sputtering.

The PVD is a process for both colouring and the improvement of wear resistance. It involves the deposition of often very hard, thin ceramic or composite coatings (hardness > 2000 HV).

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Center for plasma technologies - Plasma


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